http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018165332-A

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filingDate 2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a62a055ecebd9ef0216959dea213c19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6945033053db86880320855782110e2
publicationDate 2018-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018165332-A
titleOfInvention Polishing composition
abstract The problem to be solved by the present invention is to provide a polishing composition for polishing hard and brittle materials, which improves the polishing rate per unit current value and suppresses vibration of the polishing machine. Is. A polishing composition for polishing a hard and brittle material containing a dispersion medium and abrasive grains, wherein the content of abrasive grains having a particle diameter of less than 30 nm is 4.0 of the entire abrasive grains. The content of abrasive grains having a particle diameter of less than 30% and a particle diameter of 30 nm to less than 60 nm, abrasive grains having a particle diameter of 60 nm to less than 100 nm, and abrasive grains having a particle diameter of 100 nm to less than 140 nm are all 2.0% of the total abrasive grains. Polishing composition which is volume% or more. [Selection figure] None
priorityDate 2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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