http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018163950-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C48-305
filingDate 2017-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37e48c3e6a5a8cc0de40e2f9f8efb128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e444ca39c9841e8147e24805f6d6c34
publicationDate 2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018163950-A
titleOfInvention Base film and method for producing the same
abstract The present invention provides an inexpensive base film capable of suppressing a decrease in withstand voltage characteristics and the like, omitting large-scale production equipment and control, and preventing delamination of the film, and a method for producing the same. A base film 1 serving as a dielectric of a film capacitor, a base layer 2 formed into a thin film by a molding material containing a thermoplastic resin, and a thin film poly-layer bonded to the base layer 2 A paraxylylene-based resin layer 3; and a thin metal layer 4 laminated on one of the base material layer 2 and the polyparaxylylene-based resin layer 3. The thickness of the base material layer 2 is 1.0 to The thickness of the base layer 2 and the polyparaxylylene resin layer 3 is 50% or more, the thickness of the polyparaxylylene resin layer 3 is 0.1 to 5 μm, and the metal layer 4 The surface resistance value is in the range of 0.1 to 10Ω / □. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020537347-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7122374-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021193844-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11569036-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220160541-A
priorityDate 2017-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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