| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2017-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3e3a0dda8e3be8b2558829dda2bc0e7 |
| publicationDate |
2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018162351-A |
| titleOfInvention |
Resin composition for sealing and semiconductor device |
| abstract |
A semiconductor device having an excellent appearance of a sealing resin layer is provided. A sealing resin composition includes an epoxy resin and an inorganic filler, and a color difference ΔE * of a structure using the sealing resin composition obtained by the following formula (I) is 0.00. It is 1.50 or less. ΔE * = [(L * 1-L * 0) 2 + (a * 1-a * 0) 2 + (b * 1-b * 0) 2 ] 1/2 (I) [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019098026-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11244878-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019098026-A1 |
| priorityDate |
2017-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |