http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018148206-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa614084c7ada546f330aa10d8c627b3 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-12 |
| filingDate | 2018-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01fc3c50ed3395bc362ba817d11d2ad2 |
| publicationDate | 2018-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018148206-A |
| titleOfInvention | Optical semiconductor device and package of the optical semiconductor device |
| abstract | An object of the present invention is to provide an optical semiconductor device and a package of the optical semiconductor device, which are characterized by low process difficulty, low cost, high resistance to ultraviolet rays and high light extraction efficiency as compared with conventional methods. By the way. [Solution] An optical semiconductor device includes a substrate, a photoelectric semiconductor chip, and a package. The optical semiconductor chip is provided on the substrate. The package covers the photoelectric semiconductor chip on the substrate, and includes an ultraviolet light transmissive adhesive and a plurality of ultraviolet light transmissive particles, and the plurality of ultraviolet light transmissive particles are ultraviolet light transmissive adhesive. It is mixed in the agent. The weight% of the plurality of ultraviolet light transmissive particles in the package exceeds 50%, and the difference in refractive index between the plurality of ultraviolet light transmissive particles and the ultraviolet light transmissive adhesive is less than 0.02. The ultraviolet durability of the plurality of ultraviolet light-transmitting particles is superior to that of the ultraviolet light-transmitting adhesive. The present invention further discloses an optical semiconductor device package. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022264980-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11152545-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020033327-A1 |
| priorityDate | 2017-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.