| abstract |
The present invention provides an adhesive film having not only adhesion and heat resistance but also storage stability as an adhesive film (B-stage storage stability) and high extensibility. A polyol resin having a weight average molecular weight of 100,000 to 1,000,000 and a hydroxyl value of 60 mgKOH / g to 110 mgKOH / g, 30 to 80% by mass of a solid epoxy resin, 10 to 50% by mass, and acid anhydride A thermosetting adhesive film containing at least 10 to 50% by mass of the product. [Selection figure] None |