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filingDate 2018-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018142713-A
titleOfInvention Assembly of semiconductor devices
abstract The yield of an LED display is improved. A method of manufacturing a display comprising depositing a non-conductive underfill 2226 on a thin film transistor (TFT) layer 2212 of a substrate of the display, and a first light emitting diode on the non-conductive underfill. (LED), heating the non-conductive underfill at a first temperature to attach the first light emitting diode to the thin film transistor layer, and attaching the first light emitting diode to the thin film transistor layer Then, a second light emitting diode is disposed on the non-conductive underfill, and the non-conductive underfill is heated at a second temperature so that the contacts of the first and second light-emitting diodes are connected to the thin film transistor. Connecting to a layer, wherein the second temperature is higher than the first temperature. [Selection] Figure 22
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