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filingDate 2017-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018142650-A
titleOfInvention Film forming method and plasma processing apparatus
abstract An object of the present invention is to fill a recess of an object to be processed with a predetermined deposit. A process for holding the interior of a chamber at a predetermined pressure and placing a stage on which an object is placed on a stage cooled to an extremely low temperature of −20 ° C. or lower, and a low vapor pressure in the interior of the chamber. Supplying a gas containing a material gas; generating plasma from the supplied gas containing a gas of the low vapor pressure material; and a precursor generated from the low vapor pressure material by the plasma in a recess of the object to be processed And a deposition method. [Selection] Figure 5
priorityDate 2017-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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