| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06 |
| filingDate |
2017-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3c977565a1f65108ed27d861b1bf0c3 |
| publicationDate |
2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018141106-A |
| titleOfInvention |
Thermosetting resin composition, resin sheet with carrier substrate and semiconductor device |
| abstract |
A thermosetting resin composition excellent in low-temperature storage stability and void suppression is provided. The thermosetting resin composition of the present invention is a thermosetting resin for forming an adhesive layer that bonds a first electronic component and a second electronic component that are connected to each other via a connection terminal. A polyfunctional (meth) acrylate comprising a thermosetting resin and a compound having flux activity, wherein the thermosetting resin has a cyclic structure having two or more (meth) acryloyl groups. Including. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022059095-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7314808-B2 |
| priorityDate |
2017-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |