| abstract |
Provided is a liquid epoxy resin encapsulant capable of suppressing the occurrence of fillet cracks when an underfill cured product is left under high temperature aerobic conditions. A liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler, and (D) an antioxidant represented by the following formula: (A) an epoxy resin and (B ) A liquid epoxy resin sealing material comprising 0.5 to 10 parts by mass of the antioxidant (D) when the total amount of the amine curing agent is 100 parts by mass. [Selection figure] None |