http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018129495-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_faa5b9d292a113e1e92b0bb040d9da8d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate | 2017-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6246add98372d17a917f9761abf2bbc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2e1108c930a5b68166af0b82382c9cb |
| publicationDate | 2018-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018129495-A |
| titleOfInvention | Manufacturing method of component mounting board |
| abstract | A method for manufacturing a component mounting board having an electromagnetic wave shielding layer with high productivity, high quality, and high coverage is provided. A method of manufacturing a component mounting substrate 101 according to the present invention includes a step of mounting a component 30 on a substrate 20, a step of mounting an electromagnetic wave shielding sheet 2 on the substrate 20, and at least a part of a stepped portion. A step of heat-pressing the exposed surface of the substrate 20 to be included to obtain the electromagnetic wave shielding layer 1. The electromagnetic wave shielding sheet 2 has a scale-breaking strain of 50 to 1500%, has a scale-like particle-containing layer exhibiting isotropic conductivity containing a conductive filler containing a binder component and scale-like particles, and is anisotropically conductive. When the thickness of the electromagnetic wave shielding layer 1 that covers the upper surface of the component 30 is T1, and the thickness that covers the side surface is T2, using a sheet that does not include a layer, T1 / T2 is 1.1 to 10, and scaly particles The average thickness is set to 0.05 to 2 μm, and the exclusive area of the conductive filler in the cut section cross section in the thickness direction of the scaly particle-containing layer is set to 20 to 50%. [Selection] Figure 9 |
| priorityDate | 2017-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.