http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018127565-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
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filingDate 2017-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bf4e2b6cf8b9ff09a2f0353a18ec384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ceb0ca0b54972820ac6d380a5194837c
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publicationDate 2018-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018127565-A
titleOfInvention Resin composition and cured product
abstract A resin composition capable of producing a cured product having low elasticity even at a high temperature of 100 ° C. or higher. (A) A compound represented by the following general formula (1), (B) a compound having a bisphenol A skeleton and a weight average molecular weight of 10,000 to 100,000 in terms of polystyrene, (C) curing Containing the agent and (D) filler, the component (A) and the component (B) are different compounds, and the content of the component (A) relative to the total amount of the component (A) and the component (B) The content of the component (C) is 50 to 90% by mass, the content of the component (B) is 10 to 50% by mass, and the total amount of the component (A) and the component (B) is 100 parts by mass. Provided is a resin composition having an amount of 0.1 to 30 parts by mass and a content of the component (D) of 300 to 2000 parts by mass. [Selection figure] None
priorityDate 2017-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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