http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018126887-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-24 |
filingDate | 2017-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd87e3d0042035d13ab4bf70c2c582d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2a590d46fc62687174b6b47df044e5c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2f43f5adf5b8ad77128056af05bc362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d367ca71cd2cc6ef04b680cc042ebcf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_915e435591bf32dc37c01765c8c6c386 |
publicationDate | 2018-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2018126887-A |
titleOfInvention | Method for producing multilayer polyimide film |
abstract | Provided is a method for producing a multilayer polyimide film that can be suitably used for a high-frequency circuit board capable of reducing transmission loss. SOLUTION: A non-thermoplastic polyimide layer 2 having a dielectric loss tangent at 10 GHz of 0.001 to 0.009 is laminated on at least one surface of a non-thermoplastic polyimide film 1, and further a thermoplastic polyimide layer 3 is laminated, The manufacturing method which heat-processes so that a volatile matter amount may be 8 weight%-18 weight%, obtains a prefilm, heat-processes a prefilm, and obtains the multilayer polyimide film 4. FIG. [Selection] Figure 1 |
priorityDate | 2017-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 100.