Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_800cb9ea13490b2be4ac36483ca026bf |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2200-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-054 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-6486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0663 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0851 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0829 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-6482 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-5085 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
filingDate |
2017-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76eb5ea835dd2d72eb1501e78f45b620 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_661623d18c0fd00ff943d557a57d9d6b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb77b6be9ed65742a84c85a78f9f705c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d129b7f5779c1163e7dda00617575b29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_150869a469776186bca290be1c949508 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d254ff6e1750e243b2b41bf079c6689 |
publicationDate |
2018-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2018120167-A |
titleOfInvention |
Pattern forming method, semiconductor device and manufacturing method thereof |
abstract |
PROBLEM TO BE SOLVED: To form a good pattern using a silicone resin. A pattern forming method using a silicone resin, a step of forming a resist pattern 11 on a substrate 10, and a step of forming a silicone resin layer 21 so as to embed the resist pattern 11 on the substrate 10. The step of pressing and adhering the film 31 to the surface of the silicone resin layer 21, the step of curing the silicone resin layer 21 after application of the film 31, and the silicone resin after curing or before curing of the silicone resin layer 21 The process of peeling the film 31 from the layer 21 and the process of removing the resist pattern 11 after peeling of the film 31 are included. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7364688-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11629402-B2 |
priorityDate |
2017-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |