| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2015-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24ef466fc3607e925bf3e57161456513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d434a8d74c444b4cb1246e8a0f9f0c95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d773c26933f47f09f8fae9fcf14edf1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a0acc6b510ca764de19434633b49404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57d69c998ba644a25a483999a8d015ba |
| publicationDate |
2018-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018119996-A |
| titleOfInvention |
Substrate processing method, resin composition, and electronic device manufacturing method |
| abstract |
A substrate processing method capable of forming a high-resolution resist pattern and thereby enabling ultra-fine semiconductor elements, and a resin suitably used as a planarizing film or the like in this substrate processing method A composition and a method for producing an electronic device using the substrate processing method are provided. (A) a step of forming a first film on a substrate using a resin composition (a) containing a resin (P) having an Onishi parameter greater than 4.5; (B) the first Forming a second film on the film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) whose polarity is changed by the action of an acid; (C) the second film A substrate processing method comprising: exposing a film; and (D) developing the exposed second film to form a pattern. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7160485-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102546332-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190083334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019536102-A |
| priorityDate |
2015-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |