http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018118766-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-00
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filingDate 2017-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40ea9ddb2f1e2979feb50853076e66bc
publicationDate 2018-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018118766-A
titleOfInvention Cover tape and packaging for electronic parts
abstract The present invention provides a cover tape excellent in adhesion to a paper carrier tape and adhesion resistance to electronic components, and a package for electronic components using the same. A cover tape of the present invention comprises a paper carrier tape having a base material layer and a sealant layer provided on one surface side of the base material layer, and having a recess capable of accommodating an electronic component. A cover tape used for sealing, wherein the peel strength of the sealant layer with respect to the paper carrier tape after heat sealing, measured by a predetermined peel test, is 5 gf to 100 gf, The adhesion ratio of the metal piece to the sealant layer measured in the adhesion test A is 10% or less. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220031892-A
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priorityDate 2017-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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