http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018117058-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate | 2017-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a50a97bac81445dc008ce0fd833358e6 |
publicationDate | 2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2018117058-A |
titleOfInvention | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
abstract | A semiconductor manufacturing apparatus and a semiconductor device manufacturing method capable of realizing a polished shape with low cost and good reproducibility are provided. In a mixing tank BR, a first mixing slurry produced by mixing a raw solution slurry, an oxidant, and pure water is subjected to rough polishing through a slurry pipe SP and a first branch pipe SP1; Then, it is sent to the second polishing section PO2 that performs final polishing through the slurry pipe SP and the second branch pipe SP2. Then, to the first polishing table PT1 of the first polishing section PO1, the second preparation slurry in which the oxidizing agent and pure water are added to the first preparation slurry from the preparation pipes BP1 and BP2 connected to the first branch pipe SP1. Is supplied to the second polishing table PT2 of the second polishing section PO2, and finish polishing is performed. [Selection] Figure 3 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11541503-B2 |
priorityDate | 2017-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.