| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F287-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2017-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d5fad52ade4a8dd9b5ac65d3db3402b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42d3066de7e1b4894abb2aaa467a5d65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68534dfd7264336efdb7178f7be6b700
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e84e1e32480ebbc3fa771ca8105d6b23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35c2df17a7d44e3ae206c06edb0a2d02 |
| publicationDate |
2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018116958-A |
| titleOfInvention |
Method for manufacturing circuit board device |
| abstract |
Provided is a circuit board device manufacturing method that is excellent in connection reliability and that is less prone to malfunction even when stress due to bending or pulling is applied. A manufacturing method of a semiconductor device includes a deformable circuit board 4, an electronic member 3 provided on at least one main surface of the circuit board, and a cured resin that seals at least a part of the electronic member. 1 and a sealing step of sealing the electronic member by providing the liquid resin composition 5 on the main surface of the circuit board on which the electronic member is provided, and A curing step of curing the liquid resin composition to obtain the cured resin 1, and a resin composition having a stretch recovery rate after curing of 80% or more is used as the liquid resin composition. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020184110-A1 |
| priorityDate |
2017-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |