http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018115331-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20 |
| filingDate | 2018-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_788274d2cd5783eb9bb6147ba37c1a5a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cda2e4352ab90e11fdd3e0113135aad3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc00c507b39948b998443bb8d676e700 |
| publicationDate | 2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018115331-A |
| titleOfInvention | Adhesive tape and semiconductor device manufacturing method |
| abstract | To provide an adhesive tape that can stably hold a chip even when dry polishing is performed in a so-called tip dicing method. A pressure-sensitive adhesive tape comprising a base material and a pressure-sensitive adhesive layer provided on one surface thereof, wherein the absolute value of a 60 ° C. TMA value of the base material is 30 μm or less. The absolute value of the dimensional change after holding the substrate at 60 ° C. for 3 minutes is 0.8% or less, and is determined from the tensile elastic modulus (E23) at 23 ° C. and the tensile elastic modulus (E60) at 60 ° C. The said adhesive tape whose elastic modulus change rate E (23-60) obtained is 30% or less. The said adhesive tape stuck on the surface of a semiconductor wafer in the process of grinding the back surface of a semiconductor wafer and dividing a wafer into a semiconductor chip. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021065071-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019181730-A1 |
| priorityDate | 2018-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.