| abstract |
In a process of manufacturing a mask used for forming elements, circuits, etc. by etching a substrate using a photoresist, the photoresist adhering to the edge portion or the back surface of the substrate is efficiently removed. A composition is provided. The resist removal composition of the present invention is a composition comprising a surfactant and a solvent, and contains at least the following component (A) as the surfactant. Component (A): Polyglycerin derivative represented by the following formula (a) R a O— (C 3 H 5 O 2 R a ) n —R a (a) [In formula, n shows the number of the said repeating units and is an integer of 2-60. R a is the same or different and represents a hydrogen atom, a hydrocarbon group having 1 to 18 carbon atoms, or an acyl group having 2 to 24 carbon atoms. Provided that at least two of (n + 2) R a are a hydrocarbon group having 1 to 18 carbon atoms and / or an acyl group having 2 to 24 carbon atoms. [Selection figure] None |