| abstract |
【Task】 Provided is a resin composition capable of obtaining a cured film having a low stress and a high chemical resistance, capable of withstanding a chemical treatment associated with coil pattern formation, with low warpage during lamination. [Solution] A resin composition comprising (a) an alkali-soluble resin, (b) an aromatic ring to which a methylol group is bonded, and a compound having a linear aliphatic structure. [Selection figure] None |