http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018110240-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate | 2018-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58e18b1cf0bde4b162f7fdffec351c8d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f467ec0e675f2db24a67db059b96d1b |
publicationDate | 2018-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2018110240-A |
titleOfInvention | Lamination method of resist film |
abstract | A laminating method for causing a resist film to follow the shape of a concave portion of a substrate is provided. When a substrate having a recess is heated at a first temperature and is placed on the substrate by heating at a second temperature lower than the first temperature, the opening of the recess is covered with a resist film, and a cavity portion is covered. The resist film 30 is heated at a third temperature higher than the first temperature, and the resist film 30 is brought into contact with the inner wall of the recess. In the method of laminating the resist film 30, the resist film 30 is laminated by thermocompression bonding under a first atmospheric pressure and disposed on the substrate 20, and the resist film 30 is heated under a second atmospheric pressure higher than the first atmospheric pressure. To do. The second atmospheric pressure may be higher than the first atmospheric pressure and lower than the pressure of thermocompression bonding. [Selection] Figure 2 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023136084-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019235404-A1 |
priorityDate | 2018-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.