Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdf3b6ced3d7710ec0bc0addb67a1cc9 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0688 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-8258 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78648 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7869 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78696 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66969 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B99-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-1156 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8234 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-788 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786 |
filingDate |
2017-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_949501fab1aab8582f126f6a2d4786ac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77007015a794376887af832cf5140610 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a89e19cdb3634bdcfca0661a3d3cec89 |
publicationDate |
2018-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2018107447-A |
titleOfInvention |
Semiconductor device and manufacturing method of semiconductor device |
abstract |
A semiconductor device with high on-state current is provided. A first conductor disposed on a substrate, a first insulator disposed on the first conductor, and a first oxidation disposed on the first insulator. A second oxide disposed on the first oxide; a second insulator disposed on and in contact with a top surface of the second oxide; and a side surface of the second oxide; A second conductor disposed on the second insulator; a side surface of the second insulator; and a third insulator disposed in contact with the side surface of the second conductor. The film thickness of the second oxide is equal to or greater than the length of the second oxide in the channel width direction, and the second conductor is connected to the upper surface and the side surface of the second oxide via the second insulator. The carrier density on the side surface of the second oxide is larger than the carrier density on the upper surface of the second oxide. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020201873-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020201870-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020229919-A1 |
priorityDate |
2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |