http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018107301-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9210f9f76e13a17e9689251c57a44538 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
| filingDate | 2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ebb56ff8f441bdc2624a5d45259f058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5643bcbc5d2c5db270bff1227c2e8973 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0463db4cba75c004eb5a55ea1f537458 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aab5583c6fd7f34c85c911e7ee852c1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c4846fc8312352cf304ee4c69e22dda http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_358f559c79d474da8fc3eba9a7646dce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbfe4c2fb9510ebdaceabc4851316211 |
| publicationDate | 2018-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018107301-A |
| titleOfInvention | Polishing pad |
| abstract | In a polishing pad used in a process of mechanically flattening the surface of an insulating layer formed on a semiconductor substrate such as silicon or the surface of a metal wiring, flatness for flattening irregularities and the wafer surface of a semiconductor wafer A suitable polishing pad capable of achieving both internal uniformity is provided. A polishing layer containing a foamed polyurethane sheet having closed cells with micro rubber A hardness of 70 degrees or more and a polyurethane elastomer of 20% by mass to 30% by mass and having an average single fiber diameter of 3.0 μm or more. A structure in which an adhesive layer made of a material having an elastic modulus of 5.0 MPa or more and 17.0 MPa or less and having a thickness of 70 μm or more and 150 μm or less is interposed between the cushion substrate layer made of a nonwoven fabric of ultrafine fiber bundles of 8.0 μm or less. A polishing pad comprising: [Selection figure] None |
| priorityDate | 2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 148.