| abstract |
The present invention provides a multilayer carrier foil, a core structure formed of the multilayer carrier foil, a printed circuit board, and an electronic device. Furthermore, the present invention provides a method for manufacturing the multilayer carrier foil, the core structure, and the printed circuit board. The multilayer carrier foil is a copper carrier layer having a release surface and a laminated surface, the copper carrier layer (a) having nodules on the laminated surface of the copper carrier layer as needed, and the copper carrier A chromium release layer (b) applied to the layer (a), an intermediate copper layer (c) applied to the chromium release layer (b), and an anti-migration layer applied to the intermediate copper layer (c) ( d) and an ultrathin copper layer (e) applied to the anti-migration layer (d). [Selection] Figure 2 |