http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018085483-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2016-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9708282b98cc58885e7575f9544a200b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcbc7f680b12254396365ccef3d30951 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_effa1d2920d48626b0f3494e3f655184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ffb7edb25e55cd8667eb4e0ec7df004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05e71c093fd0d37058d0d932b7983756 |
| publicationDate | 2018-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018085483-A |
| titleOfInvention | Subdivided semiconductor wafer with adhesive and semiconductor device manufacturing method |
| abstract | An object of the present invention is to provide a divided semiconductor wafer with an adhesive part that can effectively prevent the occurrence of defective division of the adhesive part. A divided semiconductor wafer with an adhesive portion according to the present invention includes a divided semiconductor wafer divided into individual semiconductor chips by a pre-dicing method, and an adhesive layered on the surface of the divided semiconductor wafer. An adhesive portion, and the adhesive portion has a recess at a position corresponding to a gap between adjacent semiconductor chips on a surface of the adhesive portion opposite to the side of the divided semiconductor wafer. [Selection] Figure 1 |
| priorityDate | 2016-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 286.