| abstract |
An object of the present invention is to provide a photosensitive resin composition capable of obtaining a cured film having a low thermal linear expansion coefficient and low residual stress on a substrate. SOLUTION: (A) One or more kinds of resins selected from polyimide, polyimide precursor, polyamide, and polybenzoxazole precursor, (B) organic fine particles, (C) a photosensitive agent, and (D) a solvent. A photosensitive resin composition to be contained, wherein the (B) organic fine particles contain a resin, and the elastic modulus of the resin contained in the (B) organic fine particles is 0.01 GPa or more and 1.70 GPa or less. Resin composition. [Selection figure] None |