http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018044120-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 |
| filingDate | 2016-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57d60e2617f8a07dbf6445a10dc9f68c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90c76436c5c490b3dd44b78df39998a7 |
| publicationDate | 2018-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018044120-A |
| titleOfInvention | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
| abstract | Of various properties required for a laminated board for printed wiring boards, a resin composition excellent in plating peel strength, low water absorption, and low dielectric loss tangent, and a prepreg and a metal foil tension using the resin composition It aims at providing a laminated board, a resin sheet, and a printed wiring board. A resin composition containing an active ester resin (A) represented by the following general formula (1) and an epoxy resin (B). [Chemical 1] (In General Formula (1), each R independently represents an organic group having 1 to 10 carbon atoms, m is 0 or 1, and n is 1 to 10.) [Selection figure] None |
| priorityDate | 2016-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 356.