| abstract |
The present invention provides a cleaning composition for removing a resin mask that has excellent resin mask removability and a small wastewater treatment load. In one aspect, the present disclosure contains an inorganic alkali (component A), an organic solvent (component B), and water (component C), and the coordinates of the Hansen solubility parameter of component B are δd = 17.5. , Δp = 5.0, δh = 11.5 in the range of a sphere having a radius of 1.5 MPa0.5, and the content of component C when using the cleaning composition is 85% by mass or more. Further, the present invention relates to a resin mask peeling cleaning composition, wherein the mass ratio (A / B) of component A to component B is 1 or more and 60 or less. [Selection figure] None |