| abstract |
A wiring board capable of improving connection reliability is provided. A wiring structure is formed on an upper surface of an insulating layer in the wiring structure, a part of the upper surface is formed on a smooth surface, and the remaining upper surface is formed on a roughened surface. The wiring layer 50 having 50B, a conductive material that is more excellent in migration resistance than the wiring layer 50, covers the smooth surface 54C, and has the upper surface that is the smooth surface 55A, and the wiring layer 50 and the protective film 55 And an insulating layer 61 covering the surface. The wiring structure 12 includes a through hole 61X that penetrates the insulating layer 61 in the thickness direction and exposes the upper surface of the protective film 55, and a via wiring 70V that fills the through hole 61X. The roughened surface 54A is formed continuously with the smooth surface 54C and is recessed below the smooth surface 54C so as to expose the lower surface of the outer peripheral portion of the protective film 55. The insulating layer 61 is formed of the protective film 55. The upper and lower surfaces and the side surfaces of the outer peripheral portion are covered. [Selection] Figure 2 |