| abstract |
An object of the present invention is to make it possible to form a plating layer on the surface of a resin molded article without adding an LDS additive to a thermoplastic resin composition. A composition for forming a laser direct structuring layer comprising a curable compound, an organic solvent, and a laser direct structuring additive, a kit containing the composition, or a resin with a plating layer using the composition Disclosed is a method for producing a molded article. [Selection figure] None |