http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018002796-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13
filingDate 2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0bff9057987fa96bd75907cd96af5d2
publicationDate 2018-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018002796-A
titleOfInvention Polyamideimide resin heat-resistant resin composition and coating film, coating plate and heat-resistant coating material using the same
abstract [PROBLEMS] To provide a polyamide-imide resin-based heat-resistant resin composition excellent in heat resistance and adhesion after high-temperature curing at 350 ° C. or higher, and a coating film, a coating plate and a heat-resistant paint using the same. provide. (A) Polyamideimide resin obtained by reacting a diisocyanate compound or diamine compound with a tribasic acid anhydride or tribasic acid anhydride chloride in a basic polar solvent, and (B) an anti-aging agent. And a polyamideimide resin-based heat-resistant resin composition, a coating film using the same, a coating film plate, and a heat-resistant paint. [Selection] Figure 1
priorityDate 2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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