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filingDate 2015-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017538297-A
titleOfInvention Method for manufacturing high resistivity semiconductor-on-insulator wafer with charge trapping layer
abstract A method of making a single crystal semiconductor handle wafer in the manufacture of a semiconductor-on-insulator device is provided. A single crystal semiconductor handle wafer is fabricated to include a charge trapping layer that is oxidized. The resulting buried oxide layer of the semiconductor-on-insulator device includes an oxidized portion of the charge trap layer and an oxidized portion of the single crystal semiconductor device layer.
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