| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2475-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2375-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2369-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D171-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-0423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-043 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20 |
| filingDate |
2015-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017531073-A |
| titleOfInvention |
Thermoformable polymer thick film transparent conductor and its use in capacitive switch circuits |
| abstract |
The present invention relates to a polymer thick film transparent conductor composition that may be used in applications where thermoforming of the base substrate is performed, such as in capacitive switches. Polycarbonate substrates are often used as the substrate, and polymer thick film conductive compositions may be used without any barrier layer. Depending on the particular design, the thermoformable transparent conductor may be under or on the thermoformable silver conductor. Thermoformable electrical circuits benefit from the presence of an encapsulant layer on the dried polymer thick film transparent conductor composition. The electrical circuit may then be subjected to an injection molding process. |
| priorityDate |
2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |