| abstract |
Disclosed is a dielectric composite material for a fingerprint sensor detection layer manufactured with an epoxy resin, a phenol resin, a first dielectric filler, a second dielectric filler, a curing agent, an adhesion promoter, a release agent, and a flame retardant. To do. The dielectric composite material for the fingerprint sensor detection layer has a high dielectric constant, a low dielectric loss, a very stable dielectric property, a small change in test frequency, a non-transparent, high hardness. In addition to satisfying the requirements for the thickness of the manufactured fingerprint sensor detection layer, it satisfies the requirements for reliability and stability, and can be applied to various portable electronic products. Since the dielectric composite material for the fingerprint sensor detection layer does not contain heavy metal lead, it contributes to environmental conservation. Because it is convenient and highly secure, the final product manufactured with this material can be used as an alternative to a digital input password identification system, but it can also be used for any electronic components that require confidentiality. It can be surely secured. |