| abstract |
Thermal interposers using low-stress photopatternable silicone for use in the production of electronic products supplied in packaging of LEDs, logic and memory devices, and other semiconductor products where thermal management is required A manufacturing method is provided. The photopatternable silicone composition, the thermally conductive material, and the low melting point compliant solder form a complete semiconductor package module. Photopatternable silicone is applied onto the surface of the wafer and selectively irradiated to form openings that provide for user-defined bondline thickness control. Next, the openings are filled with a highly conductive paste, thereby forming a highly conductive thermal link portion. A low melting point curable solder is then applied between the structured z-axis thermal interposer and the heat sink and / or substrate, which can be a wafer or PCB, by wetting the silicone and the heat transfer path. Resulting in low contact thermal resistance. [Selection] Figure 1 |