http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017510470-A

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-241
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26
filingDate 2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017510470-A
titleOfInvention Polishing pad and system, and method for making and using the same
abstract The present disclosure relates to a polishing pad including a polishing layer, the polishing layer including a working surface and a second surface opposite the working surface. The work surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped protrusions. The present disclosure further relates to a polishing system, the polishing system including any one of the polishing pads and polishing solutions described above. The present disclosure relates to a method for polishing a substrate, the polishing method comprising: providing a polishing pad according to any one of the polishing pads; contacting a work surface of the polishing pad with a substrate surface; Moving the polishing pad and the substrate relative to each other while maintaining contact between the work surface and the substrate surface, the polishing being performed in the presence of a polishing solution. [Selection] Figure 1A
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7133684-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022002305-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020529332-A
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priorityDate 2014-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002371121-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004214510-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009215363-A1
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Total number of triples: 34.