| abstract |
The present invention comprises a hermetically sealed envelope material (3) having an internal pressure lower than atmospheric pressure, and a core material (5) made of an organic aerogel disposed inside the envelope material (3). It is related with the vacuum heat insulation board (1). The organic airgel is based at least in part on a resin derived from polyhydroxybenzene R and formaldehyde F, the organic airgel comprising a monolithic organic containing at least one water-soluble cationic polyelectrolyte P. A polymer gel or a pyrolysis product of a monolithic organic polymer gel in the form of a porous carbon monolith containing at least one water-soluble cationic polyelectrolyte P pyrolysis product Organic airgel has a thermal conductivity in the range of 10 to 40 mW · m −1 · K −1 at atmospheric pressure. [Selection] Figure 1 |