| abstract |
The present invention provides a plasma film forming method and a plasma film forming apparatus capable of generating a highly stable and uniform plasma and obtaining a highly uniform film. An object to be processed is disposed in a chamber, a film forming gas is supplied into the chamber, a plasma is generated in the chamber, and the film forming gas is excited by the plasma to form a predetermined on the object to be processed. In forming the film, helium gas is supplied as a plasma generating gas together with the film forming gas into the chamber, and plasma containing helium gas is generated in the chamber. [Selection] Figure 2 |