| abstract |
Provided is a wiring board capable of reducing warpage and suppressing a decrease in reliability when a positional deviation between an external connection pad and a mounting board occurs. In a semiconductor device, the center position of a reinforcing material 111 is unevenly distributed on one surface side of the first insulating layer from the center position in the thickness direction of a single-layer first insulating layer. One end surface of the through wiring 12 is exposed from one surface of the first insulating layer, and is connected to the wiring layer of the stacked body 1S in which the wiring layers 14, 16, 18 and the insulating layers 15, 17 are stacked. The first recess 11x is formed at the position recessed from the other surface of the insulating layer, the first insulating layer forms the inner surface, and only the external connection pad 13 is formed. The external connection pad is formed along the bottom surface and the inner surface of the first recess, extends from the inner surface to the other surface of the first insulating layer located around the first recess, A second recess 13x that is recessed toward the through wiring is formed inside the portion that extends to the other surface of the one insulating layer. [Selection] Figure 1 |