| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
| filingDate |
2016-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6676acb826e82e48899dd73b5e127908
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4793012aac25ce41304c8bfaf1aa245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6542bb7a0e2a09022a466ede6627fdff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d31bbe07dd1354d60645e92a187a600 |
| publicationDate |
2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017218532-A |
| titleOfInvention |
Adhesive for semiconductor, semiconductor device, and method for manufacturing semiconductor device |
| abstract |
To provide an adhesive for a semiconductor that can secure a good connection (contact) while suppressing voids and obtain good reflow resistance when used in the manufacture of a semiconductor device. A semiconductor adhesive comprising (a) a resin component having a weight average molecular weight of less than 10,000, (b) a curing agent, (c) a silanol compound, and (d) an acetylacetonate aluminum chelate. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020090000-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020090205-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7342879-B2 |
| priorityDate |
2016-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |