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filingDate 2016-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017217866-A
titleOfInvention Heat-sealable resin film and method for producing the same, laminate, and packaging material
abstract [PROBLEMS] To remarkably suppress adhesion and remaining even if the content is rich in oil by applying surface processing to the film surface without adding modifiers such as fine particles and lubricant components. Provided is a heat-sealable resin film. The heat-sealable resin film of the present invention has a concavo-convex structure on the surface, the arithmetic average roughness Sa of the surface is 0.1 μm or more and 2.0 μm or less, and the maximum height Sz is 1.0 μm or more. , 20 μm or less. [Selection] Figure 1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017218533-A
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