http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017214281-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C27-10 |
| filingDate | 2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca7d9484eb5779857a18f9c9809a4df1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1287722b786e0faf5515e56c568a15b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bba8effd0b05cbe2dafae80f3cade141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af755f4bbca0b7a3370c7799f54872b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_445e1b35e24dfbc45e229a1a225b7085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_624b9826f4c968af18a9684db2a690af http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de745afdc6504ac1e1f60cd6e9672374 |
| publicationDate | 2017-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017214281-A |
| titleOfInvention | Bulk annealing of glass sheets |
| abstract | To create a temporary bond that is strong enough to withstand FPD processing (including LTPS processing) but weak enough so that the sheet can be peeled away from the carrier even after high temperature processing. A method for controlling adhesion between a carrier and a thin sheet is described. Provided in a sheet (20), carrier (10) or both to control both room temperature van der Waals (and / or hydrogen) bonding as well as high temperature covalent bonding between a thin sheet and a carrier. A surface modified layer (30) and an associated heat treatment. Room temperature bonding is controlled to be sufficient to hold the thin sheet and carrier together, for example, during vacuum processing, wet processing and / or ultrasonic cleaning processing. And at the same time, high temperature covalent bonding is controlled to prevent permanent bonding between thin sheet and carrier during high temperature processing and to maintain sufficient bonding to prevent delamination during high temperature processing Is done. [Selection figure] None |
| priorityDate | 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.