| abstract |
The present invention provides a curable composition that simultaneously secures the adhesion between an inorganic substrate and an organic substrate. A (meth) acrylic oligomer (component A) having a molecular weight of 5,000 or more (component A), a (meth) acrylic monomer (component B), and at least one selected from a photoradical polymerization initiator or a thermal radical polymerization initiator. A curable resin composition containing a radical polymerization initiator (component C) and having a viscosity of 150 mPa · s or less. The component (B) is a (meth) acrylate of 10 mPa · s or less, and the (meth) acrylate comprises an alicyclic (meth) acrylate, a hydroxyl group-containing (meth) acrylate, and a C6-30 alkyl (meth) acrylate. A curable resin composition to be included. [Selection figure] None |