http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017208529-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate | 2017-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdf47da07c6bafd1f0c2804b4758434c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb15b3ad3fdd66baacf53abd953d76c |
| publicationDate | 2017-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017208529-A |
| titleOfInvention | Manufacturing method of semiconductor package |
| abstract | A semiconductor package manufacturing method capable of easily and sufficiently forming a metal film up to a side surface of a semiconductor package separated by dicing. A bonding process for affixing a pressure-sensitive adhesive sheet having at least a pressure-sensitive adhesive layer and a dicing layer to a semiconductor package before being separated, and a semiconductor package for the semiconductor package to which the pressure-sensitive adhesive sheet is affixed And dicing until it cuts a part of the dicing layer, and a dicing process for separating into pieces, and the dicing layer is peeled from the semiconductor package after dicing, and the separated semiconductor package and the adhesive A transfer step of transferring the laminate having layers to the temporary fixing material 4 with a distance between the laminates, a sputtering step of sputtering the laminate to form the metal film 3 on the surface of the semiconductor package, A peeling step of peeling the semiconductor package having the metal film formed on the surface thereof from the pressure-sensitive adhesive layer; [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020077709-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6992564-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019140201-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018143014-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021192341-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7184458-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019102745-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021112238-A1 |
| priorityDate | 2016-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 201.