| abstract |
A fluororesin-containing thermosetting resin composition containing a non-aqueous dispersion of a fluororesin having a fine particle size, low viscosity, and excellent storage stability, a cured product thereof, and an adhesive composition for a circuit board. A resin composition comprising a fluororesin micropowder, a nonaqueous dispersion of a fluororesin containing a compound represented by the following formula (I) and a nonaqueous solvent, and a cyanate ester resin and / or an epoxy resin. And a fluororesin-containing thermosetting resin composition characterized by comprising: [Selection figure] None |