| abstract |
A polyacetal resin composition in which even when a molding method in which a resin composition is exposed to a high temperature for a long time is applied, the thermal decomposition of the polyacetal resin is small, and the amount of formaldehyde released from the molded product and the mold contamination are small. To provide things. SOLUTION: (A) 100 parts by mass of a polyacetal resin, (B) 0.001 to 0.2 parts by mass of a nitrogen-containing hindered phenol compound, and (C) 0.0001 to 0.1 parts by mass of talc. A polyacetal resin composition containing. [Selection] Figure 1 |