| abstract |
A photosensitive resin composition in which, after a high temperature storage test, a void is not generated at the interface of the Cu layer contacting the photosensitive resin layer after curing, and a highly adhesive resin layer is obtained. A method for forming a cured relief pattern using the photosensitive resin composition, and a semiconductor device having the cured relief pattern. A photosensitive resin composition having a carbonyl group-containing cyclic compound in a photosensitive resin composition having a specific structure to provide a cured film in which void generation at an interface contacting a Cu layer is suppressed after a high-temperature storage test. Resin composition. [Selection figure] None |