| abstract |
Provided is a material capable of forming an interlayer insulating film that can further lower the reaction temperature and further enhance mechanical properties (breaking elongation, etc.). SOLUTION: Reaction promotion for promoting polymerization of polymerizable monomer (M), imide compound (Z) represented by general formula (z-1), and polymerizable monomer (M) and imide compound (Z) Composition for forming interlayer insulating film containing agent (A) and polymerization initiator, method for forming interlayer insulating film and interlayer insulating film pattern containing this polymer, and interlayer insulating film on support With a device. In formula (z-1), R1 and R2 represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. RZ00 represents a divalent organic group containing an aliphatic hydrocarbon group and / or an aromatic hydrocarbon group. RZ01 and RZ02 represent an alkyl group or an alkoxy group. n1 and n2 are 0 or 1. [Chemical 1] [Selected figure] None |