| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive for electronic parts which does not easily flow out during press-bonding and is excellent in pasting workability and solder heat resistance. SOLUTION: An acrylic copolymer (A) having a glycidyl group and having a mass average molecular weight of 300,000 to 1,500,000, a crosslinking component (B) for crosslinking the acrylic copolymer (A), and a resol type An adhesive for electronic parts, comprising a phenol resin (C), wherein at least a part of the glycidyl group of the acrylic copolymer (A) is crosslinked by the crosslinking component (B). [Selection figure] None |