http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017171992-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-30 |
filingDate | 2016-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e71a24e5d32572231e020289afaa5227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb488b9fa4bb28c62ff69df20ef9d766 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e1dbabb693cf2284e636d034790b876 |
publicationDate | 2017-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2017171992-A |
titleOfInvention | Etching solution composition for silver-containing material and etching method |
abstract | A silver-containing material can be etched at a higher speed while suppressing generation of a residue containing silver chloride as a main component in spite of containing hydrogen chloride, and there is little thinning of the membrane. An etching solution composition for a silver-containing material capable of forming a fine wire is provided. SOLUTION: It contains (A) nitric acid 0.1 to 10% by mass, (B) sulfuric acid 0.1 to 20% by mass, (C) hydrogen chloride 13 to 30% by mass, and water, and the specific gravity is 1.10. It is -1.15, and is an etching liquid composition for silver containing materials whose pH is less than 1. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11639470-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112853357-A |
priorityDate | 2016-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 144.